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Huawei: Industry-Academia Collabs Key to “Top Challenges” and Talent Cultivation

SHENZHEN, China, June 1, 2022 /PRNewswire/ — William Xu suggests promoting talent development through proposing tech challenges and supporting tech competitions

At the Times Higher Education’s Asian Universities Summit yesterday, William Xu introduced Huawei’s approaches to collaboration with universities on innovation, research, talent cultivation, and tech competitions. Xu, Huawei’s Director of the Board and Chair of the Scientist Advisory Committee, described the successes the company had already achieved following these approaches in his online speech titled “Industry-Academia Collaboration for Joint Innovation and Talent Cultivation.”

Xu stated, “Huawei works with universities to build open and innovative platforms for joint research and talent cultivation. Through the dual drivers of vision and application research, the industry and academia work together to define ‘top challenges’ and conduct innovation. These efforts are aimed at resolving the problems facing the industry and making groundbreaking achievements.” He added that Huawei had already invested US$400 million into university collaboration in 2021 alone, and intends to invest more for deeper collaboration in the future.

When it came to the specifics of Huawei’s approach to collaborating with universities, Xu explained that the first step was to build an open and innovative platform for joint research and talent cultivation. Huawei sees universities as “lighthouses” for the industry, and wants them to devote themselves to basic research and address long-term challenges through “0 to 1” inventions. It sees industry as a driver of engineering expertise that can help overcome industrialization challenges that arise in real-world scenarios. Under Huawei’s approach, universities, research institutes, and businesses align their definitions of “top challenges” to help reach a consensus on industry vision and challenges and explore next-generation technologies. These dual drivers of vision and application research then lead both industry and academia to conduct research into basic theories and advanced technologies, as well as across domains. This collaborative approach ensures that research and talent can keep up with the latest industry developments.

Huawei currently works with over 300 universities and 900 research institutes around the world. In 2021, it invested US$400 million in university collaboration. The company also advocates for industry input into university course and program design, joint talent training, and tech competitions, as it can help industry identify and cultivate talent at numerous levels. As a representative from the industry side, Xu proposes five ways industry and academia could work together to deepen their collaboration:

(1) Continuing to support breakthroughs in basic research and technology, and continuous industry innovation;

(2) Working together to set and solve problems, and making breakthroughs to overcome key industry challenges;

(3) Working together to optimize the design of academic programs and courses, and driving industry-academia alignment to cultivate urgently-needed talent;

(4) Working together to encourage innovation and identify and cultivate talent by building platforms like Huawei’s own joint labs, tech competitions, Chaspark, Seeds for the Future, and post-doctoral research programs; and

(5) Strengthening talent exchanges between universities and the industry to promote transitions from theory to practice.

Huawei currently identifies and cultivates its top talent by supporting international tech competitions, both financially and by supplying these competitions with technical challenges. These competitions also expand the horizons of participating students as they have the opportunity to put theory into practice. In addition, Huawei works closely with China’s Ministry of Education on course and program design, high-level talent training, outstanding engineer training, reconstruction of key national labs, the release of industry challenges, and the creation of a collaborative, intelligent industry-university base for talent cultivation.

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AI Chipmaker Hailo Collaborates with Renesas to Enable Automotive Customers to Seamlessly Scale from ADAS to Automated Driving

Joint solution is available now to enable powerful, efficient and safe automotive ECUs  

TEL AVIV, Israel, June 27, 2022 /PRNewswire/ — Hailo, the leading edge Artificial Intelligence (AI) chipmaker, today announced its collaboration with Renesas, a premier supplier of advanced semiconductor solutions, to deliver a powerful and energy-efficient processing solution enabling advanced driver-assistance (ADAS) functions and automated driving (AD) systems in motor vehicles. The joint Hailo-Renesas solution will make sophisticated ADAS technology more accessible in cars of all types.

The joint Hailo-Renesas solution will make sophisticated ADAS technology more accessible in cars of all types.
The joint Hailo-Renesas solution will make sophisticated ADAS technology more accessible in cars of all types.

The combination of Hailo-8 processors, designed for heavy Neural Network (NN) acceleration, with the powerful Renesas R-Car V3H & R-Car V4H systems-on-chip (SoCs), powers robust, scalable, efficient, and cost-effective ADAS solutions for zonal and centralized vehicular ECUs. The solutions are scalable for a wide range of ADAS functions from ADAS L2+ up to L4 AD functions requiring very high tera-operations per second (TOPS), while delivering best-in-class TOPS/W.

“ADAS and AD features have proven to be instrumental in minimizing accidents and saving lives. However, technological challenges have caused great difficulties for automakers looking to make such advanced functions accessible in anything but higher-end vehicles,” said Orr Danon, CEO and Co-Founder of Hailo. “Together with Renesas, we are offering a solution helping democratize ADAS, so its benefits can be enjoyed by more and more drivers. AI will play a major role in making our roads safer, and with industry leaders like Renesas helping us innovate, we will make driving both safer and more affordable.”  

“Automotive OEMs are looking for scalable solutions for ADAS and AD to streamline software development,” said Yusuke Kawasaki, Director, Automotive Digital Products Marketing Division at Renesas. “We are confident that our collaboration with Hailo, which has expertise in AI technology, will enable our customers to easily extend the performance of the R-Car so that they can flexibly and quickly incorporate ADAS/AD functionality in various classes of vehicles.”

Key features for the joint Hailo-Renesas solution include:

  • Independent scalability in AI & compute, allowing flexibility and cost-effectiveness for Level 2+ to Level 4 ADAS designs
  • The highest performing solution available today in the automotive market, ranging from 60 TOPS to over 170 TOPS for multi-sensor perception and fusion
  • Best-in-class power efficiency, enabling ECUs to be passively cooled, which reduces the BOM and system cost
  • Functional safety for the ADAS/AD ECU with Renesas R-Car (R-Car V4H is expected to achieve ASIL-B and D metrics for the real-time domain) and Hailo (Hailo-8 supports ASIL B)        
  • An open software ecosystem allowing OEMs/Tier-1s more control & possibility for innovation

A single Hailo-8™ delivers unprecedented performance to edge devices. Featuring up to 26 TOPS at a typical power consumption of 2.5 W, the chip is built with an innovative architecture that enables edge devices to run sophisticated Deep Learning applications that could previously only run on the cloud. Hailo-8’s advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge.

Hailo continues to make significant strides in the automotive industry, partnering with industry leaders to create high-performance, scalable AI solutions for automotive Electronic Control Units (ECUs), enabling power-efficient AI acceleration with low energy consumption to advance automotive innovation.

The joint Hailo-Renesas solution is available for customer evaluations and demonstrations. It will be showcased live at Automobil Elektronik Kongress in Ludwigsburg (Germany) on June 28-29.

About Hailo

Hailo, an AI-focused, Israel-based chipmaker, has developed a specialized AI processor that delivers the performance of a data center-class computer to edge devices. Hailo’s processor is the product of a rethinking of traditional computer architecture, enabling smart devices to perform sophisticated deep learning tasks such as object detection and segmentation in real-time, with minimal power consumption, size, and cost. The processor is designed to fit into a multitude of smart machines and devices, impacting a variety of sectors including automotive, Industry 4.0, smart cities, smart homes, and retail. For more information visit https://hailo.ai/

Hailo media contact:
Garrett Krivicich
Headline Media
garrett@headline.media 
+1 786 233 7684

 

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Bespin Global Vietnam – Daewoo E&C THT Development, signed MOU for AMI Pilot Project in the Star Lake New Town with EVNHANOI

  • Cooperation for AMI(Implementation of Smart Power Meter) pilot project and AI-based operation in Star Lake New Town in Hanoi, Vietnam
  • Significance in ‘Open Innovation’ collaboration between Vietnamese state-owned company and Korean private enterprises
  • First step towards the stable and safe power supply, as well as data based Smart City

SEOUL, South Korea, June 8, 2022 /PRNewswire/ — Cloud delivery platform company, Bespin Global(https://bespinglobal.com, CEO HanJoo Lee) announced on June 8th that its Vietnamese subsidiary – Bespin Global Vietnam, a local subsidiary of Daewoo Engineering & Construction – THT Development Company, and Hanoi Power Corporation – EVNHANOI, recently signed an MOU for AMI(Advanced Metering Infrastructure, intelligent remote meter reading infrastructure) pilot project in Star Lake New Town.

Bespin Global Vietnam, EVNHANOI and Daewoo E&C THT Development are signing MOU for AMI Pilot Project in the Star Lake New Town. From left, General Director of Daewoo E&C THT Development, Kuk-jin An, General Director of Hanoi Power Corporation, Nguyễn Danh Duyên, and Head of Bespin Global Vietnam, Ted Kim
Bespin Global Vietnam, EVNHANOI and Daewoo E&C THT Development are signing MOU for AMI Pilot Project in the Star Lake New Town. From left, General Director of Daewoo E&C THT Development, Kuk-jin An, General Director of Hanoi Power Corporation, Nguyễn Danh Duyên, and Head of Bespin Global Vietnam, Ted Kim

The MOU was signed to upgrade the system and provide benefits to users by introducing a pilot infrastructure applied with AMI within Star Lake New Town in Hanoi, Vietnam, which is independently created by Daewoo Engineering & Construction. This will not only improve convenience, but also enable the collection, analysis, and integrated operation of data, which will take a step forward in the implementation of a true Smart City. The AMI, under the direction of the Prime Minister of Vietnam, is a pilot project that the Vietnam Electricity Corporation is pursuing in two regions(Hanoi and Ho Chi Minh City) by 2025. It is expected to become one of Vietnam’s core technology standards in the future by being linked to the Smart City Data Integrated Management Platform(THT-BESPIN SMART CITY HUB) jointly built and operated by Bespin Global and THT Development.

Through the cooperation of three organizations, it is possible to analyze the trend of power use by hour, day, and month along with monitoring power usage. In addition, based on real-time data, existing collected data, and weather forecasts, it is also possible to predict the power consumption of residents, buildings and cities as a whole, and the power optimization method is also automatically supported.

This MOU is especially meaningful since Korean private companies support the core platforms for data collection, integration and analysis, and have achieved cooperation in terms of open innovation with Vietnamese state-owned company. It is expected to contribute to the creation of a new business model based on data in the future, as well as serve as a stepping stone for the establishment of a Smart City standardization model.

Nguyễn Danh Duyên, General Director of EVNHANOI said, “By applying AMI’s Industry 4.0 application technology, we can build a customer management ecosystem. We will be able to efficiently manage customers with self-monitoring, daily power production monitoring, and self-calculation of electricity bills which will help to improve customer satisfaction.”

An Kuk-jin, General Director of Daewoo E&C THT Development, said, “By jointly establishing AMI infrastructure with Hanoi Power Corporation in the central area of the Star Lake City project, a foundation for providing safe and stable power has been established. This is the most basic and important element of Smart City, and it is one of the successful cases of applying the data-based ‘Smart City 2.0 Standard Model’ developed by Daewoo Engineering & Construction and Bespin Global to the public sector.” He added that “This partnership will be a very meaningful step towards expanding the ‘Smart City 2.0 Standard Model’ that organically connects cities, operates on a data basis, and continues to create new values.”

Ted Kim, General Manager of Bespin Global Vietnam, said, “In order to provide users with high-quality Smart City services, it is essential to build a platform for the collection and analysis of a large number of data generated by facilities and services.” He stressed that “Based on Bespin Global’s technology and vision for a smarter world, we will take the lead in fostering innovative industrial models and providing more convenient and pleasant lives to citizens by integrating and analyzing the data generated in cities.”

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global supply chains threatened by DNS attacks

The down-time and massive disruptions caused by phishing and malware are jeopardizing the world’s manufacturing industries, says this zero-trust proponent.

The Industry 4.0 era has provided manufacturers with the digital capabilities to make industrial manufacturing and the management of local, regional and global supply chains more efficient and sustainable.

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